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Technology

Thinning copper solution:Micro-etch rate is stable, not with the copper ion concentration decreased; high copper ion tolerance; reduce operating costs;

Copper surface micro-etching agent: H2SO4 / H2O2 system. It has the advantages of fast and stable microetching rate, large amount of copper, bright appearance, simple post-treatment and no pollution. It has been adopted by many manufacturers.

Gold surface protection agent:Can be resistant to salt spray test 72h, 140h high temperature 2h, anti acid and sweat test 48 hours.